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ESD9C3.3ST5G SERIES
Transient Voltage
Suppressors
Micro ? Packaged Diodes for ESD Protection
The ESD9C3.3ST5G Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
http://onsemi.com
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
1
2
XM
supplies and many other portable applications.
Specification Features:
? Low Capacitance 6.2 pF ? 13 pF
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039 ″ x 0.024 ″ (1.0 mm x 0.60 mm)
? Low Body Height: 0.016 ″ (0.40 mm) Max
? Stand ? off Voltage: 3.3 V, 5 V
? Low Leakage
? Response Time < 1 ns
? ESD Rating of Class 3 (> 16 kV) per Human Body Model
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? These are Pb ? Free Devices
PIN 1. CATHODE
2. ANODE
MARKING
DIAGRAM
SOD ? 923
CASE 514AB
X = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device Package Shipping ?
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
ESD9CxxST5G
SOD ? 923
(Pb ? Free)
8000/Tape & Reel
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
MAXIMUM RATINGS
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Air
Symbol
Value
± 8.0
± 15
Unit
kV
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Junction and Storage Temperature
Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
? P D
T J , T stg
T L
150
? 55 to +150
260
mW
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 3
1
Publication Order Number:
ESD9C3.3S/D
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